High density interconnection device



FIG. 1 is a rear perspective view illustrating a high densityinterconnection device in accordance with one embodiment of theinvention.

FIG. 2 is a front perspective view of the high density interconnectiondevice of FIG. 1.

FIG. 3 is a front elevation view of the high density interconnectiondevice of FIG. 1.

FIG. 4 is a rear elevation view of the high density interconnectiondevice of FIG. 1.

FIG. 5 is a first side elevation view of the high densityinterconnection device of FIG. 1.

FIG. 6 is a second side elevation view of the high densityinterconnection device of FIG. 1.

FIG. 7 is a top plan view of the high density interconnection device ofFIG. 1.

FIG. 8 is a bottom plan view of the high density interconnection deviceof FIG. 1.

FIG. 9 is a rear perspective view illustrating a high densityinterconnection device in accordance with another embodiment of theinvention.

FIG. 10 is a front perspective view of the high density interconnectiondevice of FIG. 9.

FIG. 11 is a front elevation view of the high density interconnectiondevice of FIG. 9.

FIG. 12. is a rear elevation view of the high density interconnectiondevice of FIG. 9.

FIG. 13 is a first side elevation of the high density interconnectiondevice of FIG. 9.

FIG. 14 is a second side elevation view of the high densityinterconnection device of FIG. 9.

FIG. 15 is a top plan view of the high density interconnection device ofFIG. 9; and,

FIG. 16 is a bottom plan view of the high density interconnection deviceof FIG. 9.

The broken line portions of the disclosure are for illustrative purposesonly and form no part of the claimed design.

The ornamental design of a high density interconnection device, as shownand described.